Huang, YongAn et al.: Modeling and Application of Flexible Electronics Packaging. Singapore, Springer, 2019. XVII, 287 p. Hardcover. Versand aus Deutschland / We dispatch from Germany via Air Mail. Einband bestoßen, daher Mängelexemplar gestempelt, sonst sehr guter Zustand. Imperfect copy due to slightly bumped cover, apart from this in very good condition. Stamped.

• Category: Technik
• Keywords: Elektrotechnik
• Language: English (en)
• ISBN: 9789811336263
• Order Number: 3190MB

Our Price: EUR 17,--